NEWS and EVENTS

 

July 11 2017: CIEES team participated in Fuse Hub solution forum in Saratoga Springs...

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July 6 2017: CIEES hosts a delegation from Center for Advanced Materials Processing (CAMP), Clarkson University...

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June 8 2017, CIEES presents at Stony Brook University Incubator Showcase, ...

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May 25 2017: CIEES delegation presented at HIA-LI 29th Annual Business Trade Show & Conference ... more

 

CIEES to hold a  first Workshop on Energy Storage and Electrical Systems on  October 5 2017... more

 

March 22-23, 2017: CIEES delegation participates in the 1st CAT Collaboration Symposium, Syracuse, NY, ...

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January 24 2017: CIEES delegation participated in CAT advocacy day in NY State Capitol, Albany, NY, ...

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October 25, 2016: CIEES delegation participates in NYSTAR director meeting in Rochester, NY, ...more

 

September 15, 2015: NYSTAR awards university $10 million to create new Center for Advanced Technology in Integrated Electrical Systems, ...more

 

Facilities for characterization of energy-related materials:

 

TRANSMISSION ELECTRON MICROSCOPE (TEM), JEOL JEM 1400

  • Resolution (Lattice Image/ Point Image): 0.20 nm/ 0.38 nm
  • Optimized take-off angle for best peak-to-background ratios and light element detection
  • UPRIGHT CONFOCAL MICROSCOPE, Leica TCS SP8 X
  • Upright Leica DM 6000 with adaptive focus, motorized XY-Stage (15 nm step size) and Super Z Galvo (1500µm/ 3 nm step size)
  • Tandem scanner 8 KHz:
  • Detection range: 400-800 nm
  • Internal detection channels: 2xPMT, 2x HyD
  • Transmitted light detectors: BF (Brightfield) prism for DIC measurement in confocal mode
  • Equipped with Tokai Hit Stage Incubator providing 37˚C and 5% CO2 for live cell imaging

 

SCANNING PROBE MICROSCOPE WITH HYSITRON ATTACHMENT, Bruker Dimension ICON

  • Materials mapping
  • Nanomechanics characterization
  • Nanoelectrical characterization
  • Biological characterization

 

AMG EVOS FL MICROSCOPY

  • Light cubes: DAPI (Ex 360nm/ Em 447nm), GFP (ex 470 nm/ Em 525 nm), RFP (Ex 530nm/ Em 593 nm), White (for non-transparent samples)
  • Objectives: 4x, 10x, 20x, 40x LWD objectives and 100x coverslip-corrected oil objective
  • Equipped with Bioptechs stage temperature controller providing 37˚C for live cell observation
  • THERMOMECHANICAL CHARACTERIZATION
  • Thermal Gravimetric Analysis (TGA, TA Q50):
  • Temp. range: ambient+5~1000oC
  • Differential Scanning Calorimetry (DSC, TA Q2000):
  • Temp. range:  -90~550 oC
  • Dynamic Mechanical Analysis (DMA, TA Q800):  Temp. range:  -145~600 oC
  • Thermal Conductivity Meter (DTC-300): Temp. range: -20~300 oC;
  • Thermal conductivity range: 0.1~40 W/m.K

 

SPECTROSCOPIC ELLIPSOMETRY, Horiba UVISEL FUV

  • Thin film thickness from 1 Å to 30 µm
  • Surface and interface roughness
  • Optical constants (n, k) for isotropic, anisotropic and graded films
  • Characterization of thickness and optical constants in the VIS-FUV spectral range of thin films and multilayer stacks for:
  • Dielectrics
  • High k, low k materials
  • Photo resists
  • Plastics
  • Amorphous semiconductors
  • Thin metal films
  • Glass
  • Polymers

 

TEM SAMPLE PREPARATION

  • Leica EM UC7 with Cryo Attachment
  • High quality ultra-microtome for precise room temperature and cryo sectioning (-15~ -185˚C)

 

 

 

MATERIALS CHARACTERIZATION

Center for Integrated Electric Energy Systems (CIEES)

Stony Brook University

Stony Brook, NY 11794-6217

www.sbuciees.org